PFORZHEIM, Germany -- AMI DODUCO, a Technitrol (NYSE:TNL) Company, offers the printed circuit board (PCB) industry a new flux material for hot-air levelling using lead-free solders. Hot-air levelling of tin/lead solder is the traditional surface finish for PCBs, but effective July 1, 2006, the European Union’s Restriction of Hazardous Substances (RoHS) Directive will prohibit the use of lead in electrical and electronic appliances throughout the European Union. Solders containing lead must be replaced by lead-free alternatives such as tin/copper/nickel alloys. These solders, however, require a higher working temperature than conventional tin/lead materials.
Lead-free DOFLUX meets the need for hot-air levelling fluxes that can activate the new solder coatings at these higher temperatures. The new flux material is also very sparing in use and has good wetting properties.
DOFLUX is the latest in an expanding line of AMI DODUCO products for RoHS-compliant, lead-free surface finishing. This product family also includes the DODUCHEM® chemical nickel/gold process for circuit boards and the DODUBRONCE® AF white bronze bath for technical and decorative applications.
Headquartered in Export, Pennsylvania, AMI DODUCO is a global leader in electrical contact technology and fabrication. The company supplies contacts and assemblies, contact materials and clad metal products, electroplating and surface treatment services, and precious metal refining and recycling to more than 3,000 customers. AMI DODUCO operates from locations in North America, Europe and Asia. The company’s website is www.amidoduco.com.
Copyright © 2005 AMI DODUCO, Inc. All rights reserved. All brand names and trademarks are properties of their respective holders.
Cautionary Note: This message contains "forward looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Actual results may differ materially. This release should be read in conjunction with the factors set forth in Technitrol's report on Form 10-Q for the quarter ended April 1, 2005 in Item 2 under the caption "Factors that May Affect Our Future Results (Cautionary Statements for Purposes of the 'Safe Harbor' Provisions of the Private Securities Litigation Reform Act of 1995)."
