• Plating on Printed Circuit Boards
  AMI DODUCO offers a wide range of surface coatings for PCBs (rigid, rigid-flex, flex).
  • Electroplating processes:
    Fine Au for wire bonding, hard Au, Ag (hard), Sn, SnPb, for special applications also Pd or Rh.
  • Immersion (electroless) processes:
    DODUCHEM®: Ni/Au
    DODUSTAN®: Sn

• Special Coatings
  With regard to economical handling of resources AMI DODUCO offers partial coating of individual parts as a favorable alternative to overall coating under application of special masks and covering techniques.

• Rack Plating
  In order to reach optimum results in electroplating of new products and complicated part geometry's the employment of racks and the setting of parameters for the electroplating of metals is very important. Therefore, AMI DODUCO has an in-house rack construction department, which develops and manufactures the required racks in close cooperation with the surface specialists.

• Barrel Plating
  For electroplating of bulk goods in many layer combinations and different coating thickness AMI DODUCO applies the optimum electroplating aggregates and appropriate production lines for every part geometry and batch size.

• Precious metals:
  fine Au, Au-alloys, AuCo, Ag, Pd, PdNi, Rh.
• Other metals:
  Ni, electroless Ni, Sn, SnPb90/10, SnPb60/40 bright & mat, Cu, bronze
• DODUCHEM®:
  electroless Ni/Au
• DODUSTAN®:
  electroless Sn

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• all usual base materials
• especially: AI, AI-alloys.; Zinc die-casting
• special base materials: AISiC, Mo

Dimensions:

• PCBs up to 650 x 650mm
• Rack plating up to 1000 x 500 x 200mm
• Other dimensions by request

• Electroplated strips and punched strips
  Electroplating processes are a supplement to cladding techniques. The strips can be solid or pre-stamped. The selective deposition of thin layers complie with economical processing requirements. Especially in case of the electroplated hard gold layers, however, bending and forming processes should be carried out before the electroplating process.
  • Plating Types and Procedures
    Dipping Process
    Electroplating, complete or selectively on both sides, of solid or punched strips
    Spot Electroplating
    Spot plating of contact surfaces on pre-stamped or punched strips and grids
    Strip Electroplating
    Strip electroplating of solid strips using roller cell or masking techniques
    Selective Electroplating
    Selective electroplating of punched parts belted on strips using brush plating technique
    Electroplating of Wires
    Electroplating with precious metals
  • Coating Materials
    Gold
    Fine gold and hard gold (AuCo 0,3), layer thickness 0,1—3µm, in special cases up to approx. 10m
    Silver
    layer thickness 0,5—10µm, in special cases up to approx. 40µm, additionally with anti tarnish protection (SILVERBRITE® W)
    Palladium-Nickel
    layer thickness of PdNi20 can be up to 5µm, additionally a gold flash (AuCo 0,3) is applied
    Copper
    as an intermediate layer, thickness 1-5µm
    Nickel
    as diffusion barrier, thickness up to 4µm
    Tin
    Pure tin or Tin-lead-alloys can be electroplated (Sn, SnPb40, SnPb10, SnPb5)
  • Base materials
    Copper and copper alloys,
    nickel and nickel alloys,
    stainless steel as well as beryllium-bronze
  • Dimensions
    strip thickness 0,07—2,0mm,
    strip width up to 120mm,
    depending on electroplating process
• Hot-dip tinning of strips
  The hot-dip tinning of strips is an alternative to electroplated tin. Usually coatings of tin-lead alloys (SnPb40) are applied. Depending on the base material and the dimensions of the strip, also pure tin or SnPb10 can be applied. As a substitute, tin-copper are tested. The thickness of hot-dip tin coatings is, due to the process characteristics about 10±5µm.
  • Base Materials
    Copper and copper alloys,
    nickel and nickel alloys,
    stainless steel as well as beryllium-bronze
  • Dimensions
    strip thickness 0,1—1,0,
    strip width up to 130mm

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• The Ideal Completion to Electroplating
  As a completion and extension of the electroplating processes AMI DODUCO offers coatings by Physical Vapor Deposition (PVD).
  With this process also non conducting substrates made from plastics, ceramics and glass or Titanium and alloys thereof, can be coated. Additionally, layers from materials which cannot be deposited by an electroplating process, e.g. W, Ti, AI, TiN, many alloys and compounds, etc., can be realized.
  On the other hand electroplating processes can be used to increase thickness of PVD layers.

Advantages of PVD Coatings

Precious Metal Baths for Technique and Decoration

• Gold bath DURAMET® and DODUREX®
• High-performance hard gold process (Au/Co) DODUREX® HS 100 for electroplating of strips
• Rhodium baths RHODIOR®
• Rhodium/palladium combined process
• Silver baths
• Platinum and palladium baths
• Ruthenium baths

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Precious Metal Salts and Concentrates

• Silver and gold salts
• Rhodium and palladium concentrates

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Non Precious Metal Baths

• Tin baths SOLDIMET®
• Nickel bath DODUPRINT®
• Copper baths DOCURAL®
• Bronze baths DODUBRONCE®

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Silver Non-Tarnish Protection
SILVERBRITE® W and W ATPS
An organic silver anti-tarnish protection coating on a water based fluid for rack and barrel plating.

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Solder Powders for Jewelry
for high quality machine-made chains

Nickel Stripper for Diamond Tools
In electroplated diamond tools, the grinding medium is embedded and fixed in an electroplated or electroless deposited layer of nickel. At the end of their normal life you can strip the Ni-layer completely for recoating the tool. Only the Ni-layer will be removed, without tool body being attacked by the agent.

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The Complete Program DODUPRINT® for Printed Circuit Board Manufacturing

• Electroless nickel/gold - process DODUCHEM®
• Gold and nickel electrolytes
• Electroless tin bath DODUSTAN®
• Acidic copper electrolytes
• Tin-lead-electrolytes
• Flux for hot air leveling and surface mounting
• Flux for lead free HAL-process DOFLUX®
• Metal stripper, cleaner and conditioners

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Silver Powder Products
The Basis for High-Quality Materials and Conductive Preparations

AMI DODUCO supplies silver powders with a high degree of purity and a variety of grain shapes and grain sizes. Silver powders find applications in ceramic and metallic sinter materials as well as in precious metal alloys. The silver powders are manufactured by means of special chemical, electrolytic or metallurgical processes. There is a wide range of physical characteristics (e.g. tap density and grain size distribution), so that the best possible product can be supplied for each application. In addition, silver powder is the basis for silver/silverchloride electrodes for medical technics.
Silver powders are also used in polymer systems for applications in electronics and electrical engineering, for example in conductive paints, adhesives and pastes. Here they form the conductive pigment and are therefore the key factor which determines the functionality of these products.

Our Product Range

• Microcrystalline Powders (precipated)
• Agglomerated Powders (electrolytical and precipitated)
• Flakes
• Spheroidal Powders (atomized)
• Silver/Silverchloride Electrodes

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Conductive Paints, Adhesives and Pastes

For the production of conducting layers, junctions and glues AMI DODUCO offers a broad range of conductive preparations.

• Silver Conductive Paints and Pastes
  —AUROMAL®
  for spraying and printing
  —Silver Conductive Spray DOSILAC®
  for simple, quick and cost effective application on non-conductive substrates especially suitable for subsequent electroplating processes
• Silver Conductive Adhesives
  —AUROMAL®
  to contact electrical parts on different base materials
• Graphite Paints and Pastes
  —GRAPHAROL®
  for anti-static equipment of tanks and pipes made of plastics
• Silver Preparation for Firing
  —ARGONOR®
  for metallization of ceramics and glasses

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DODUCONTA® Contact Lubricants

For Reduction of Mechanical Wear and Increase of Corrosion Resistance.

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